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Applications of the Xingtongli Rectifier

Applications-of-the-Xingtongli-Rectifier

Regarding rectifiers in electroplating process, such as chrome, zinc, copper, gold, nickel, etc., there are various types of rectifier applications.

Pulse Width Modulation (PWM) Rectifiers

PWM rectifiers are a highly controllable type of rectifier suitable for electroplating processes that require extremely precise current control. They are increasingly used in copper, aluminum and zinc electroplating.

Precise Control: PWM rectifiers utilize pulse width modulation techniques to provide extremely precise current control, suitable for high quality metal production.

Energy Efficiency: They typically operate with high efficiency, reducing energy waste.

High frequency rectifier

High frequency rectifiers are very useful in some specialized electroplating processes. They provide higher frequency output and are suitable for specific plating needs.

High Frequency Output: These rectifiers produce high frequency currents suitable for specific metal plating processes.

Reduce the electrode effect: High-frequency rectifiers can reduce the electrode effect and help improve production quality and efficiency.

Different types of rectifiers play an integral role in copper, aluminum and zinc electroplating, helping industrial processes achieve stable, efficient and high-quality results. Selecting the appropriate rectifier type depends on the specific plating process requirements and production goals.

AC rectifier (inverter)

Although DC rectifiers dominate electroplating, AC rectifiers, also known as inverters, play an important role in certain professional situations. They convert DC power back to AC power and are suitable for specific electroplating processes, especially those requiring frequency control.

Frequency Control: AC rectifiers provide an adjustable frequency output, which is especially valuable for certain electroplating processes.

Special requirements: In some cases, AC power is required to meet specific requirements, such as certain copper plating processes.


Post time: Sep-08-2023